Wen Jin Meng
Smiley and Bernice Romero Raborn Chair in Mechanical Engineering
3270E Patrick F. Taylor Hall
Department of Mechanical & Industrial Engineering
Louisiana State University
Baton Rouge, LA 70803
225-578-5832
Google Scholar Profile - Meng (click me)
Educational Background
- Ph.D., Applied Physics, California Institute of Technology, 1988
- B. S., Physics, California Institute of Technology, 1982
Research Interests
- Nanostructured thin films and coatings
- Plasma-assisted vapor deposition
- Micro/nano fabrication
Selected Publications
B. Zhang, M. Dodaran, S. Ahmed, S. Shao, W. J. Meng, K. J. Juul, K. L. Nielsen, “Grain size affected mechanical response and deformation behavior in microscale reverse extrusion”, Materialia 6, 100272/1-13 (2019).
B. Zhang, Y. Mu, M. Dodaran, S. Shao, D. Moldovan, W. J. Meng, “Mechanical failure of CrN/Cu/CrN interfacial regions under tensile loading”, Acta Mater. 160, 1-13 (2018).
B. Zhang, Y. Song, G.Z. Voyiadjis, W.J. Meng, “Assessing texture development and mechanical response in microscale reverse extrusion of copper”, J. Mater. Res. 33, 978-988 (2018).
X. Zhang, B. Zhang, Y. Mu, S. Shao, C.D. Wick, B.R. Ramachandran, W.J. Meng, “Mechanical failure of metal/ceramic interfacial regions under shear loading”, Acta Mater. 138, 224-236 (2017).
Y. Mu, X. Zhang, J.W. Hutchinson, W.J. Meng, “Measuring critical stress for shear failure of interfacial regions in coating/interlayer/substrate systems through a micro-pillar testing protocol”, J. Mater. Res. 32, 1421-1431 (2017).
B. Zhang, Y. Mu, M.C. Gao, W.J. Meng, S.M. Guo, “On single-phase status and segregation of an as-solidified septenary refractory high entropy alloy”, MRS Comm. 7, 78-83 (2017).
P.A. Primeaux, B. Zhang, X. Zhang, J. Miller, W.J. Meng, P. KC, A.L. Moore, “Aluminum-based one- and two- dimensional micro fin array structures: high-throughput fabrication and heat transfer testing”, J. Micromech. Microeng. 27, 025012/1-9 (2017).
Y. Mu, X. Zhang, J.W. Hutchinson, W.J. Meng, “Dependence of confined plastic flow of polycrystalline Cu thin films on microstructure”, MRS Comm. 6, 289-294 (2016).